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Corresponding Author

Mohsen Elkhouly, Mohamed

Subject Area

Mechanical Power Engineering

Article Type

Original Study

Abstract

Cooling of electronic equipments is playing an important role in the last decades as a world experiences a technological boom in all fields. In this study, a numerical study for mixed convection cooling of microprocessor is investigated by the use of pure water and CuO-water nanofluid at six different volume concentrations. The model is built, meshed and simulated by Ansys Fluent Package 16.0 and a mesh independence test is carried out. The study is performed by changing heat load (115W, 130W), inlet velocity, at different concentrations of nanofluids (Pure water, 0.5%, 0.86%, 1.5%, 2.25%, 3.5%, 5%). The present results showed that using CuO-water nanofluids over pure water provides an enhancement in heat transfer characteristics. The dimensionless parameters such as Nusselt number, Archimedes number, Prandtl number, friction factor and dimensionless temperature are studied and correlated. An enhancement of 36.5% in thermal hydraulic performance is found at 0.50% volume fraction at Re = 1679.212. The data are correlated with maximum error of 4.1%.

Keywords

Thermal management; Nanofluids; CFD; Electronics cooling; microprocessor

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